JPH0635383Y2 - 電子回路接続ケ−ブル - Google Patents
電子回路接続ケ−ブルInfo
- Publication number
- JPH0635383Y2 JPH0635383Y2 JP1987062007U JP6200787U JPH0635383Y2 JP H0635383 Y2 JPH0635383 Y2 JP H0635383Y2 JP 1987062007 U JP1987062007 U JP 1987062007U JP 6200787 U JP6200787 U JP 6200787U JP H0635383 Y2 JPH0635383 Y2 JP H0635383Y2
- Authority
- JP
- Japan
- Prior art keywords
- connection
- cable
- electronic circuit
- connector
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000001174 ascending effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 43
- 229910000679 solder Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062007U JPH0635383Y2 (ja) | 1987-04-23 | 1987-04-23 | 電子回路接続ケ−ブル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062007U JPH0635383Y2 (ja) | 1987-04-23 | 1987-04-23 | 電子回路接続ケ−ブル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63168977U JPS63168977U (en]) | 1988-11-02 |
| JPH0635383Y2 true JPH0635383Y2 (ja) | 1994-09-14 |
Family
ID=30895867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987062007U Expired - Lifetime JPH0635383Y2 (ja) | 1987-04-23 | 1987-04-23 | 電子回路接続ケ−ブル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635383Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562959B (zh) * | 2008-04-16 | 2013-02-13 | 鸿富锦精密工业（深圳）有限公司 | 服务器理线装置 |
| JP5058906B2 (ja) * | 2008-07-18 | 2012-10-24 | シャープ株式会社 | カメラモジュールを備えた電子機器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726544U (en]) * | 1980-07-18 | 1982-02-12 |
-
1987
- 1987-04-23 JP JP1987062007U patent/JPH0635383Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63168977U (en]) | 1988-11-02 |
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